Gold plating is one of our special processes in our plating business. We pride ourselves in producing gold-plated goods of high purity (> 99 %) and evenness. Whether it is for aesthetic purposes or electrical applications, we can meet all of our customer’s request.
| Process | Specs | Process Classification | Tank Size (L) x (W) x (H) mm | Locations |
|---|---|---|---|---|
| Gold Plating | MIL-G-45204 | Hard Gold | Ø 150 x 200 | Singapore |
| Soft Gold | Ø 150 x 200 |
Gold plating is frequently used in electronic components, such as electrical connectors and printed circuit boards, to provide a corrosion-resistant electrically conductive layer on the copper substrate.
With direct gold-on-copper plating, the copper atoms diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide and/or sulfide layer.
A layer barrier metal, often nickel, is deposited on the copper substrate before the gold plating. The layer of nickel provides a mechanical base for the gold layer to improve its wear resistance and reduces the impact of pores seen in the gold layer.